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Published by Leonardo Calcagno
Nov 16 – Nov 17
2 Place de la Porte Maillot 75017 Paris
thedielinesummit.com
The Dieline Summit will take place in November in Paris in collaboration with Emballage. The event will be a global gathering of design leaders coming together to discuss the future of the package design industry, along with the issues designers, consumer packaged goods companies, marketers, consumers, and the world environment are facing.
The speakers include Rebecca Costa, Alex Center (The Coca-Cola Company), Mary Zalla (Landor Associates), Jonathan Ford (Pearlfisher), Leland Maschmeyer (Collins), Jonathan Sands (Elmwood), and Michael Hendrix (IDEO). The Dieline Summit will offer a future-forward discussion that challenges the status-quo, and inspires creators of packaging and products to help solve today’s global problems and change the world through package design.
source: dexigner.com